LSD3015-XX 23 - dec. ligitek electronics co.,ltd. property of ligitek only data sheet LSD3015-XX single digit led display (0.3 inch) doc. no : qw0905- rev. : a date : - 2005
0.9 0.45 typ 7.5 (0.295") 5.0 0.5 5.4 (0.21") 10.0 (0.39") 19.0 (0.75") l s d 3 0 1 5 - x x l i g i t e k pin no.1 a b c d e f g r.dp 2.54*4= 10.16(0.4") 7.62 (0.3") 1/7 page LSD3015-XX ligitek electronics co.,ltd. property of ligitek only part no. package dimensions note : 1.all dimension are in millimeters and (lnch) tolerance is 0.25(0.01") unless otherwise noted. 2.specifications are subject to change without notice.
109854237 1,6 ab c def g rdp LSD3015-XX LSD3015-XX 2/7 page part no. internal circuit diagram ligitek electronics co.,ltd. property of ligitek only
anode b common cathode anode d anode a LSD3015-XX page3/7 anode c anode rdp anode g common cathode anode f anode e electrical connection part no. 1 pin no. 2 4 3 LSD3015-XX 5 7 6 8 10 9 ligitek electronics co.,ltd. property of ligitek only
LSD3015-XX 4/7 page 30 sr 100 100 mw ma ma unit symbol i f i fp pd parameter ligitek electronics co.,ltd. property of ligitek only ratings absolute maximum ratings at ta=25 forward current per chip power dissipation per chip peak forward current per chip (duty 1/10,0.1ms pulse width) part no. 2:1 iv-m iv(mcd) vf(v) electrical typ. min. 3.05 1.75 typ. min. 1.8 1.52.4 max. t opr tstg 45 635 common cathode or anode p ( nm) (nm) chip emitted red gaalas material -25 ~ +85 -25 ~ +85 common cathode note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. part selection and application information(ratings at 25) solder temperature 1/16 inch below seating plane for 3 seconds at 260 part no LSD3015-XX storage temperature operating temperature a 10 ir reverse current per any chip
LSD3015-XX 5/7 page ligitek electronics co.,ltd. property of ligitek only if=20ma test condition if=20ma if=20ma if=10ma volt vf unit nm a nm p iv mcd part no. reverse current any chip spectral line half-width forward voltage per chip peak wavelength luminous intensity per chip parameter test condition for each parameter symbol luminous intensity matching ratio iv-m irvr=5v
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 600650700750 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -4040 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 sr chip page 6/7 LSD3015-XX part no.
LSD3015-XX page7/7 description reference standard mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 test condition test item operating life test high temperature storage test low temperature storage test 1.under room temperature 2.if=10ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) part no. reliability test: this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. ligitek electronics co.,ltd. property of ligitek only the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 thermal shock test high temperature high humidity test solder resistance test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
|
